SFF

Recent SFF TWG Specification Published Updates:

• Enterprise and Datacenter 1U Short Device Form Factor (EDSFF E1.S) (SFF-TA-1006 R2.0)
Defines mechanical attributes and multiple thickness options of a 1U short form factor device that fits vertically in 1U rack-mounted host systems. This revision modifies the 9.5 mm thickness device to support both air cooling and Direct Liquid Cooling (DLC).

• Universal 4/8X Pinouts (SFF-9400 R1.1)
Outlines a set of connector pin signal definitions for an internal cable interface. The definitions are designed to prevent physical damage while supporting functionally incompatible applications, such as SAS 3, SAS 4, and PCIe®.

• Internal Low-Profile High-Speed Cable Interconnect (SFF-TA-1040 R1.0)
Defines a shielded, board-to-board cable assembly and SMT board connector interface with 74 or 124 contacts based on bandwidth needs, with right-angle exit.

• Cable Optimized Boot Peripheral Connector for OCP M-PIC (SFF-TA-1036 R1.0)
Defines a shielded, board-to-board cable assembly and SMT board connector interface with 10 differential pairs, 12 single-ended contacts, and 2 power contacts with right-angle and vertical exit.

• Universal Backplane Management (UBM) (SFF-TA-1005 R1.5)

• Cross Reference to Select SFF Connectors and Modules (REF-TA-1011 R1.3)
Defines the naming conventions for the various configurations of pluggable I/O solutions.

• QSFP+ 4X Pluggable Transceiver Solutions (SFF-8665 R2.0)
Defines the physical interface, low-speed electrical, and management interface requirements of QSFP+ 4X pluggable transceiver solutions, including: QSFP10, QSFP14, QSFP28, QSFP56, QSFP112, and QSFP224.

SFF: Who We Are

The SNIA SFF carries forth the longstanding SFF Committee work efforts that operated from 1990 until mid-2016. In 2016, SFF Committee leaders transitioned the organizational stewardship to SNIA while retaining the longstanding technical focus on specifications in a similar fashion as all SNIA TWGs do. The SFF now consists of the SFF TWG and the SFF Community.

SFF TWG:

Develops technical specifications as SNIA Technical Proposals for storage media, storage networks, AI networks, and pluggable solutions that complement existing industry standards work that encompasses cables, connectors, form factor sizes and housing dimensions, management interfaces, transceiver interfaces, electrical interfaces, and related technologies. These technical specifications enable technology vendors to procure compatible, multi-sourced products and solutions.

As appropriate, some specifications developed by the SFF TWG may be incorporated into standards or adopted as standards by EIA (Electronic Industries Association), ANSI (American National Standards Institute), IEC (International Electrotechnical Commission), PCI-SIG (Peripheral Component Interconnect Special Interest Group), or JEDEC.

SNIA posts all published SFF specifications and many DRAFT specifications for public access. These specifications are found at the link below...

SFF Specifications

SFF Community:

The SFF Community is dedicated to supporting the SFF Technical Work Group (TWG) through the promotion and marketing of SFF TWG specifications and its related needs.

Coordinate efforts with other Committees and TWGs within and outside SNIA with respect to related aligned efforts, including the SNIA Standards Committee and SNIA Strategic Alliances Committee.